Released on = October 17, 2006, 12:13 am

Press Release Author = BroadGroup

Industry = Telecommunications

Press Release Summary = A new summit evaluating the challenges and opportunities in
power and cooling for forward looking data centres will take place in London next
week.

Press Release Body = London, 17th October 2006 - The Power and Cooling Summit 2006
(www.datacentres.com/pac) for forward looking data centres, taking place October
25-26 in London, is the first meeting in the sector to focus attention on the two
foremost critical issues that impact all businesses globally.

The Summit will be officially opened by Sir Anthony Cleaver, chairman of IX Europe
the recently AIM floated data centre group, which will be attended by a target rich
audience of speakers and representatives from Europe, the Middle East, India and the
US. The Summit will assess challenges and opportunities for power and cooling in the
medium and long term. Global design and business consulting firm ARUP will also
provide a special workshop at the Summit, dealing with short term solutions for
power and cooling in data centres, and making a difference now.

Sponsors include many of the business leaders in the data centre sector, including
Emerson Network Power, APC, Active Power, Corning Cable Systems, IX Europe, Rittal
and The Colocation Exchange. The academy of speakers also includes experts from HP,
IBM, Sun Microsystems, Norman Disney Young, Hurley Palmer Flatt, Dispersia and the
University of Missouri-Colombia.

The Summit will feature an informative debate chaired by FT contributor Joia
Shillingford covering the crucial challenge of heat, and technologies to mitigate
and reduce power consumed. The Power Panel at the Summit will provide a knowledge
bank of experts to discuss alternative power, and whether the cost of power will
provoke a change in the pricing structure of data centres.

Optimising racks, and whether the demands confronting their design will lead to 35Kw
racks or higher will be addressed in depth. A panel of enterprise owned and managed
data centres will add valuable case study material to the Summit perspective of how
to tackle challenges in the medium to long term.

An equally impressive array of expertise will focus on cooling, and discuss the
merits of water and liquid cooling. New solutions will feature including Nanofluid
technologies, thermal packaging and cooling at the chip level, which will
collectively offer a detailed insight into the profound changes in cooling that are
on the horizon.

"Power and Cooling leads the way for thought leadership in this critical debate,"
commented Philip Low at BroadGroup, the summit researchers and producers. "At a time
when the US government has already initiated investigations into the power
consumption of data centres in the US, EMEA businesses need to understand what, how
and when to adopt new solutions but equally so the steps they should take in the
interim. It promises to be a fascinating and informative summit."

Contact:
Rebecca Jones
VP Communications
London
rebecca@vp-pr.com





Web Site = http://www.datacentres.com/pac

Contact Details = VP Communications
121 Oxford Gardens
London
W10 6NE

Email: enquiries@vp-pr.com
Telephone: 020 8964 0260
Facsimile: 020 8964 0277